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Key Considerations When Migrating from MCUs to Hybrid MCUs

Last modified by Microchip on 2025/06/17 12:01

When migrating from an MCU to a hybrid MCU, it is important to assess a variety of factors related to the two components' hardware capabilities, communication protocols, power consumption, and system requirements. Here’s a structured approach you can follow.

Identify System Requirements

  • Scope: Assess the current system requirements and determine if the MCU can meet the expanded computing power and memory resources needed. If not, transitioning to a hybrid MCU may be necessary.

  • Processing power: Check if the processing power (e.g., clock speed, instruction set) of the MCU or hybrid MCU matches your application’s requirements.

  • Memory requirements: Assess the system's need for RAM and Flash memory. MCUs usually have built-in memory and less RAM compared to hybrid MCUs like SAM9X6 and SAM9X series MPUs, which may require external RAM and storage. Microchip provides SiPs with integrated  SDRAM, DDRx or LPDDRx memory and an MPU. Microchip SOM takes it a step further by integrating power management, an Ethernet PHY, nonvolatile boot memory, and an optional wireless module on a small Printed Circuit Board (PCB). 

  • Peripherals and I/O: Evaluate the types of sensors, actuators, and communication interfaces (e.g., UART, SPI, I2C, GPIO) the system needs.
  • A general feature comparison table is provided here for reference:
     MCUsHybrid MCUs
    FeaturePIC32MZ DA FamilySAM E70
    Family    		SAM9X60SAM9X75
    Speed200 MHz300 MHz600 MHz800 MHz
    CoreMIPS32® microAptiv™Arm® Cortex®-M7ARM926EJ-SARM926EJ-S
    SD/SDIO/eMMC Bus Interface1122
    External BUS InterfacesQSPINOR and NAND FlashNAND & QSPINAND, QSPI, OSPI
    SDRAM SupportDDR2 SDRAM16-bit (SDRAM, SRAM)DDR2/LPDDRDDR2/DDR3L
    FlashUp-to 2 MBUp-to 2 MB––
    SRAMUp-to 640 KB256 KB, 384 KB64KB64KB
    2D GPUYesNoYesYes
    LCD InterfaceParallel RGBNoParallel RGBParallel RGB, LVDS, MIPI
    Camera InterfaceNo Image Sensor InterfaceParallel InterfaceParallel & MIPI CSI 
    CLASS DNoNo11
    CAN22 CAN-FD22 CAN-FD
    USB1 USB 2.0 OTG1 USB2.0 Device/Mini Host2x host + 1x (host or device)3 (3 hosts or 2 hosts/1 device)
    SSC & I2S audio 1 I2S2 I2S1 SSC, 1 I2S1 SSC, 1 I2S
    DMA8 16 
    Ethernet10/100 Mbps10/100 Mbps10/100 Mbps(1x MII / RMII + 1x RMII) 10/100/1000 Mbps with IEEE-1588 and TSN support
    ADC45 channels2 x 12-channel12 Channels8 Channels
    Anti Tamper ProtectionNoYes- 2PinsYes-8PinsYes-8Pins
    SecurityAES, 3DES, SHA, MD5 & HMACTRNG, AES 256, SHAAdvanced(TDES / AES / SHA + Secure bootloader)Advanced(TDES / AES / SHA + Secure bootloader)
    Timers/Compare/Capture13(9 - 16-bit, 4 -3 2-bit)Four 3-channel 16-bit Timer7(6 - 32-bit & 1 - 64-bit)8(6 - 32-bit & 2 - 64-bit)
    AEC-Q100Grade 2NoGrade 2Grade 2
    RTCCYesYesYesYes
    PWM–Two 4-channel 44
    SPI/I²S™62136
    I²C531313
    UART651313
    Pin Count169, 176, 28864-144112106
    PackagesLFBGA, LQFPQFNBGA 228BGA 240
    Operating condition-40ºC to +85ºC-40ºC to +105ºC-40°C to +125°C-40°C to +125°C

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Evaluate Processing Power and Architecture

  • MCU architecture (e.g., Arm Cortex-M, AVR® and PIC® MCU, etc.): Understand the architecture’s capabilities for handling low-level tasks such as timing, GPIO control, and interrupt handling.

  • Hybrid MCU architecture (Arm9™): Ultra-low power hybrid MCUs support multitasking, complex algorithms, and running an operating system (e.g., Linux® or RTOS).
  • Clock speed and throughput: MCUs often operate at lower clock speeds and have limited processing capabilities, while hybrid MCUs typically have higher clock speeds, up to 800 MHz, and can handle more complex tasks.

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Interfaces and I/O Compatibility

  • Peripherals: Compare the I/O interfaces, including ADCs, DACs, UARTs, SPI, I2C, GPIO, PWM, etc., and determine whether the MCU or hybrid MCUs support the necessary interfaces for the application.

  • External communication: For MPUs, you may need to connect external devices such as displays, storage (e.g., eMMC), and networking interfaces (Ethernet, Wi-Fi®, USB). Assess how the MCU or hybrid MCUs handle these connections.
  • Compatibility with external devices: Ensure the MCU or hybrid MCUs can interface with the sensors and actuators used in the application, considering voltage levels, signal integrity, and protocol support.

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Operating System (OS) Compatibility

  • MCU (no OS or RTOS): Many MCUs operate without an operating system or run a real-time operating system (RTOS), which provides real-time scheduling and task prioritization for embedded systems.

  • Hybrid MCUs (Linux, Android®, or RTOS): Hybrid MCUs often run full-fledged operating systems like Linux, bare-metal, or RTOS, which offer multitasking and complex software stacks. Hybrid MCUs support is added in mainline Linux distribution.

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Availability of Development Tools

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Software and Firmware Development Considerations

  • MCU software development: Typically involves low-level programming with languages like C, assembly, or C++. The software stack is often minimal and tailored to embedded real-time systems.

  • Hybrid MCU software development: If using a full OS (like Linux), you will need software stacks and tools for application development, kernel modifications, and possibly device driver development, which is supported for hybrid MCUs.
  • Compatibility with middleware and libraries: MPLAB Harmony v3 provides support for Hybrid MCU with the necessary software libraries and middleware for your application (e.g., communication protocols, drivers) similar to that of the MCUs.

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Power Management

  • Power efficiency: MCUs are generally more power-efficient than hybrid MCUs, making them ideal for battery-powered or low-power applications. Compare the power consumption requirements of both devices under different operating conditions.

    Hybrid MCUs typically require multiple power rails and power domains. Using a Power Management Integrated Circuit (PMIC) can simplify the design by integrating voltage regulators and control into a single component, saving design time and simplifying the board layout. The SAM9X60 SOM and SAM9X75 SOM take it a step further by integrating power management, an Ethernet PHY, nonvolatile boot memory, and an optional wireless module on a small PCB.

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Board Layout and Design

  • Plan the board layout to accommodate the hybrid MCUs, power circuitry, and memory. Using a System-in-Package (SiP) module can reduce the board area and simplify the design.

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Learn More

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