Debug Header Target Footprints
Contents
To connect a debug header directly to a target board (without the use of a transition socket), the following information will be helpful.
Dual Inline Packages (DIP) Device Footprints
The DIP device adapter footprints shown will accept adapter plugs like the Samtec series APA plugs. These plugs can be soldered into place during development/emulation and eliminate the need for any other sockets.
Figure: DIP Footprint
Thin Quad Flat Pack (TQFP)/Plastic Leaded Chip Carrier (PLCC) Device Footprints
The TQFP/PLCC device adapter footprints shown will accept board stackers like the Samtec series DWM 0.050 Pitch Stackers. These stackers can be soldered into place during development/emulation and eliminate the need for any other sockets.
Figure: Single-Row TQFP/PLCC Footprint
Figure: Double and Triple-Row TQFP/PLCC Footprint
Header pin-out matches the PLCC package. PLCC will map to TQFP as follows:
- Header to 44-pin TQFP – one-to-one mapping.
- Header to 64-pin TQFP – see "Figure: Header to 64-Pin TQFP" for mapping.
- Header to 80-pin TQFP – see "Figure Header to 80-Pin TQFP" for mapping.
- Header to 100-pin TQFP – one-to-one mapping.
Figure: Header to 64-Pin TQFP
Figure: Header to 80-Pin TQFP
