Emulation Header Target Footprints

Last modified by Microchip on 2023/12/20 19:01

To connect a debug header directly to a target board (without the use of a transition socket) the following information will be helpful.

DIP Device Footprints

The DIP device adapter footprints shown will accept adapter plugs like the Samtec series APA plugs. These plugs can be soldered into place during development/emulation and eliminate the need for any other sockets.

DIP Footprint

Figure 1: DIP Footprint

TQFP/PLCC Device Footprints

The TQFP/PLCC device adapter footprints shown will accept board stackers like the Samtec series DWM 0.050 Pitch Stackers. These stackers can be soldered into place during development/emulation and eliminate the need for any other sockets.

Single-Row TQFP/PLCC Footprint

Figure 2: Single-Row TQFP/PLCC Footprint

Double and Triple-Row TQFP/PLCC Footprint

Figure 3: Double and Triple-Row TQFP/PLCC Footprint

The header pin-out matches the PLCC package. PLCC will map to TQFP as follows:

  • Header to 44-pin TQFP – one-to-one mapping.